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m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support M02011 1 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 applications ?apon ?bpon ?atm/sonet the M02011 is a cmos transimpedance amplifier with agc. the agc gives a wide dynamic range of 40 db. the high transimpedance gain of 66 k ensures good sensitivity. for optimum system performance, the M02011 die should be mounted with a gaas or ingaas pin photodetector inside a lensed to-can or other optical sub-assembly. the M02011 can either bias the pin diode from the intern al regulator, or use an externally biased pin diode. a replica of the average photodiode current is available at the mon pad for photo-alignment and 'loss of signal' monitoring. features ? typical ?34 dbm sensitivity, +6 dbm saturation at 622 mb/s when used with 0.9 a/w ingaas pin. (cpd 0.5 pf, ber 10 ?10 ) ? typical differential transimpedance: 65 k ? fabricated in standard cmos ? differential output ? standard +3.3 volt supply ? available in die form only ? monitor output ? agc provides dynamic range of 40 db ? internal or external bias for photodiode ? pin or apd sensor ? same pad layout and die size as m02013/14/15/16 typical applications diagram pina dout doutb v cc pink 470 pf 1 nf monitor output rm typically ac-coupled to limiting amplifier limiting amplifier M02011
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 2 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 ordering information part number package operating temperature M02011-xx* waffle pack ?40 c to 95 c M02011-xx* expanded whole wafer on a ring ?40 c to 95 c note: *for full ordering number please contact sales revision history revision level date description v5 released may 2015 updated logos and page layout. no content changes. d (v4) released august 2007 production release. revised absolute maximum ratings table, table 1-1 . c (v3) released may 2007 production release. increased max operating temperature, updated specifications based on full device characterization and included information on assembly, i mon and using the device with externally biased detectors in the applications information section. pad configuration mon pina pink v cc agc dout gnd gnd doutgnd 1 2 3 4 56 7 8 9 10 11 12 v cc dout doutgnd die size 1090 x 880 m top level diagram pink mon v cc dout doutb agc gnd pina
m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support M02011 3 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 1.0 product specification 1.1 absolute maximum ratings these are the absolute maximum ratings at or beyo nd which the ic can be expected to fail or be damaged. reliable operation at these extremes for any length of time is not implied. 1.2 recommended operating conditions table 1-1. absolute maximum ratings symbol parameter rating units v cc power supply (v cc -gnd) -0.4 to +4 v t a operating ambient -40 to +95 c t stg storage temperature -65 to +150 c i in pina input current 8 (1, 2) ma pp v pina maximum input voltage at pina -0.4 to +2.0 (2) v i pink maximum average current sourced out of pink 10 ma v pink , v dout , v doutb ,v agc , v mon maximum input voltage at pink, dout, doutb, agc and mon -0.4 to vcc +0.4 v i dout , i doutb maximum average current sourced out of dout and doutb 10 ma notes: 1. equivalent to 4.9 ma average current. 2. do not exceed either the i in or v pina rating. pina damage will result in performance degradation which is difficult to detect. table 1-2. recommended operating conditions symbol parameter rating units v cc power supply (v cc ? gnd) 3.3 10% v c pd max. photodiode capacitance (v r = 1.8 v), for 622 mbps data rate 1.0 pf t a operating ambient temperature ?40 to +95 c
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 4 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 1.3 dc characteristics 1.4 ac characteristics table 1-3. dc characteristics symbol parameter min. typ. max. units v b photodiode bias voltage (pink ? pina) 1.7 2.0 2.2 v v cm common mode output voltage 0.7 1 1.3 v i cc supply current (no loads) 20 28 35 ma r load recommended differential output loading 85 100 (1) ?w note: 1. 100 is the load presented by the limiting amplifier. table 1-4. ac characteristics symbol parameter condition min. typ. (1) max. units r out output impedance (single ended) 30 50 70 w lfc low frequency cutoff (2) ?1317khz v d differential output voltage 100 differential load ? 250 450 mv dcd duty cycle distortion (3) 622 mbps ? ? 80 ps dj deterministic jitter (includes dcd) (3) 622 mbps, 2 23 ? 1 prbs ? ? 120 ps pp pdj pattern dependant jitter (at crossing point), with no dcd 622 mbps, 2 23 ? 1 prbs ? ? 55 ps pp in, rms total input rms noise dc to 467 mhz (bessel filter), cin = 0.5 pf ?5060na total input rms noise dc to 467 mhz (bessel filter), cin = 1 pf ?5670na pin_mean_min optical sensitivity (4) ?33 ?34 ? dbm imon_off monitor output offset (5) v mon = 0 to 2v ? ? 1.3 a imon_ratio monitor output gain ratio (5) v mon = 0 to 2v ? 0.7 ? ? imon_error monitor output accuracy (3, 5) v mon = 0 to 2v ? ? 2 db notes: 1. die designed to operate over an ambient temperature range of ?40c to +85c, t a and v cc range from 3.0 ? 3.6v. ty pical values ar e tested at t a = 25 c and v cc = 3.3v. 2. input ?33 dbm, extinction ratio = 10, temp = 25c. 3. input current < 1 ma average. 4. ber 10 ?10 , pd capacitance = 0.5 pf, responsivity 0.9 a/w, extinction ratio = 10, temp = 25c. 5. offset and slope adjustment necessary to achieve rated accuracy.
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 5 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 1.5 dynamic characteristics table 1-5. dynamic characteristics symbol parameter min. typ. max. units g transimpedance ? single ended ? differential 26.5 53 32.5 65 38 76 k bw bandwidth to ?3 db point @ ?33 dbm, 0.9a/w, 0.5 pf pd 450 600 ? mhz bandwidth to ?3 db point @ ?33 dbm, 0.9a/w, 1 pf pd ? 460 ? rc agc loop time constant ? 2 ? s i agc agc threshold ? 5 ? a pp i ovl maximum functional input current 3.6 (1) ??ma psrr power supply rejection, f < 1 mhz ? 22 ? db notes: 1. equivalent to +3.4 dbm input optical power at extinction ratio = 10, responsivity = 1.0 a/w.
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 6 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 1.6 typical performance v cc = 3.3v, temperature = 25c, l in = 1 nh, unless otherwise stated. figure 1-1. typical performance diagrams 1 of 3 typical differential transimpedance vs. v agc 0 10 20 30 40 50 60 70 00.511.52 v agc (v) differential transimpedance (k ? )
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 7 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 v cc = 3.3v, temperature = 25c, l in = 1 nh, unless otherwise stated. figure 1-2. typical performance diagrams 2 of 3 M02011 bandwidth vs . input capacitance 3.3v, nom, l in = 1nh 400 450 500 550 600 650 700 750 0.2 0.4 0.6 0.8 1 cin (pf) bandwidth (mhz) t = -40oc t = 0oc t = 27oc t = 85oc t = 110oc M02011 bandwidth vs . temperature 3.3v, nom, l in = 1nh 400 450 500 550 600 650 700 750 -40 10 60 110 junction temperature (oc) bandwidth (mhz) cin = 0.3pf cin = 0.5pf cin = 0.75pf cin = 1.0pf -60 -40 -20 0 20 40 60 1 10 100 1000 10000 jitter (ps) pdj ps pp dcd ps dj ps pp m 02011 jitter characteristics vs . i in 3.3v, nom, l in = 1 nh, c in = 0.5 pf, 622 mbps (note: dj = pdj + |dcd|) input current ( a pp )
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 8 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 v cc = 3.3v, temperature = 25c, l in = 1 nh, unless otherwise stated. figure 1-3. typical performance diagrams 3 of 3 M02011 imon characteristics after calibration 0 200 400 600 800 1000 1200 1400 1600 0 200 400 600 800 1000 1200 1400 input current (ua) imon current (ua) M02011 imon error after calibration -0.40 -0.20 0.00 0.20 0.40 0.60 0.80 1.00 1.20 0 1 10 100 1000 10000 input current (ua) imon error (db optical)
m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support M02011 9 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 2.0 pin definitions table 2-1. pad description die pad no name function 1 agc monitor or force agc voltage 2v cc power pin. connect to most positive supply 3 pink common pin input. connect photo diode cathode here and a 470 pf capacitor to gnd (1) 4 pina active pin input. connect to photo diode anode 5v cc power pin. connect to most positive supply (only one v cc pad needs to be connected) 6 mon analog current source output. current matched to average photodiode current 7 dout differential data output (goes low as light increases) 8dout gnd ground return for dout pad (2) 9 gnd ground pin. connect to the most negative supply (2) 10 gnd ground pin. connect to the most negative supply (2) 11 doutgnd ground return for dout pad (2) 12 dout differential data output (goes high as light increases) na backside backside. connect to the lowest potential, usually ground notes: 1. alternatively the photodiode cathode may be connected to a decoupled positive supply, e.g. v cc . 2. all ground pads are common on the die. only one ground pad needs to be connected to the to-can ground. however, connecting mo re than one ground pad to the to-can ground, particularly those across the die from each other can improve performance in noisy environments.
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 10 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 figure 2-1. bare die layout mon pina pink v cc agc dout gnd gnd doutgnd 1 2 3 4 56 7 8 9 10 11 12 v cc dout doutgnd
m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support M02011 11 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 3.0 functional description 3.1 overview the M02011 is a cmos transimpedance amplifier with agc. the agc gives a wide dynamic range of 40 db. the high transimpedance gain of 66 k ensures good sensitivity. for optimum system performance, the M02011 die should be mounted with a gaas or ingaas pin photodetector inside a lensed to-can or other optical sub-assembly. the M02011 can either bias the pin diode from the intern al regulator, or use an externally biased pin diode. a replica of the average photodiode current is available at the mon pad for photo-alignment and 'loss of signal' (los) monitoring. figure 3-1. M02011 block diagram dc restore phase splitter agc pina pink mon dout dout 2.6 v 1 v dc shift
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 12 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 3.2 general description 3.2.1 tia (transimpedance amplifier) the transimpedance amplifier consists of a high gain sing le-ended cmos amp lifier (tia), with a feedback resistor. the feedback creates a virtual earth low impedance at the in put and virtually all of the input current passes through the feedback resistor, defining the voltage at the ou tput. advanced cmos design techniques are employed to maintain the stability of this st age across all input conditions. an on-chip low dropout linear regulator has been incorporated into the design to give excellent noise rejection up to several mhz. higher freque ncy power supply noise is removed by the external 470 pf decoupling capacitor connected to pink. the circuit is designed for pin photodi odes in the ?grounded cathode? conf iguration, with the anode connected to the input of the tia and the cathode connected to ac ground, such as the provided pink terminal. reverse dc bias is applied to reduce the photodiode capacitance. avalanche photodiodes can be connected externally to a higher voltage. 3.2.2 agc the M02011 has been designed to operate over the input ran ge of +6 dbm to ?34 dbm. this represents a ratio of 1:10000 whereas the acceptable dynamic range of the outpu t is only 1:30 which implie s a compression of 333:1 in the transimpedance. the design uses a mos transistor o perating in the triode region as a ?voltage controlled resistor? to achieve the transimpedance variation. another feature of the agc is that it only operates on signals greater than ?26 dbm (@0.9 a/w). this knee in the gain response is important when setting ?signal detect? func tions in the following post amplif ier. it also aids in active photodiode alignment. the agc pad allows the agc to be disabled during pho todiode alignment by grounding the pad through a low impedance. the agc control voltage can be monitored du ring normal operation at this pad by a high impedance (>10 m ) circuit. 3.2.3 output stage the signal from the tia enters a phase splitter followed by a dc-shift stage and a pair of voltage follower outputs. these are designed to drive a differential (100 ) load. they are stable for driving capacitive loads, such as interstage filters. each outp ut has its own gnd pad, all four gnd pads on the chip should be connected for proper operation. since the M02011 exhibits rapid roll-off (3 pole), simple external filtering is sufficient. 3.2.4 monitor o/p high impedance output sources a replica average phot odiode current for monitoring purposes. this output is compatible with the ddmi re ceive power specification (sfp-8472) an d macom?s range of ddmi controllers. ensure that the voltage on v mon is in the range of 0 to 2v. refer to figure 4-1 .
m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support M02011 13 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 4.0 applications information 4.1 recommended pin diode connections figure 4-1. suggested pin diode connection methods recommended circuit pina dout doutb v cc pink 470 pf 1 nf monitor output rm M02011 alternative circuit - cathode connected to v cc pina dout doutb v cc pink 470 pf 1 nf monitor output rm 500 470 pf M02011 note: selection of rm depends on the maximum input current as detailed in ta b l e 4 - 1 .
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 14 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 4.2 monitor calibration to achieve the best monitor accuracy, both the slope and ca librated offset should be used. the offset calibration is achieved by measuring the dark current from the mon ou tput. the calibrated monitor value is usually determined by y = mx + b or: i mon_calibrated = (slope * i mon_reading ) + i mon_offset where slope = 1/imon_ratio ( table 1-4 ) = 1/0.7 = 1.43 and i mon_offset = i input@cal ? (i mon_reading@cal * slope) 4.3 selecting the monitor resistor as described earlier the high impedance monitor outp ut sources a replica average photodiode current for monitoring purposes. if detected by converting the cu rrent to a voltage through an external resistor ( figure 4-1 ), ensure that the voltage on v mon is in the range of 0 to 2v. the table below provides suggested values for the monitor resistor. table 4-1. selection of rm for maximum input current i in max (ma) optical power (dbm) rm ( ) 4 +6 500 2+3 1000 1 0 2000 0.5 ?3 4000
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 15 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 4.4 to-can layout figure 4-2. typical layout diagram with photodiode mounted on pink capacitor (5 pin tocan) notes: typical application inside of a five lead to-can. only one of the v cc pads and all of the gnd pads need to be connected. the backside must be connected to the lowest po tential, usually ground, wit h conductive epoxy or a similar die attach material. if a monitor output is not required then a four lead to-can may be used. v cc mon dout doutb 1nf 470pf
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 16 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 4.5 treatment of pink pink requires bypassing to ground with a capacitor when po wering a photo diode. if pink is not used to bias the photo diode, then it is not necessary to bypass an unused pink. figure 4-3. typical layout diagram with photodiode mounted on tocan base (5 pin tocan) note: typical application inside of a five lead to-can. only one of the v cc pads and all of the gnd pads need to be connected. the backside must be connected to the lowest potential, usually ground, wit h conductive epoxy or a similar die attach material. if a monitor output is not required then a four lead to-can may be used. v cc mon dout doutb 1nf 470pf
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 17 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 4.6 t0-can assembly recommendations figure 4-4. to-can assembly diagram m02015 ceramic shim submount to can leads (x 4or 5) pin diode wire bond to-can header m02015 ceramic shim submount to can leads (x 4or 5) pin diode wire bond to-can header not recommended example recommended example capacitor 470 pf 470 pf capacitor metal shim
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 18 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 4.6.1 assembly the M02011 is designed to work with a wirebond in ductance of 1 nh 0.25 nh. many existing to-can configurations will not allow wirebond lengths that short, sinc e the pin diode submount and the tia die are more than 1 mm away in the vertical direction, due to the need to have the pin diode in the correct focal plane. this can be remedied by raising up the tia die with a conducti ve metal shim. this will effectively reduce the bond wire length. refer to figure 4-4 for details. macom recommends ball bonding with a 1 mil (25.4 m ) gold wire. for performance reasons the pina pad is smaller than the others and also has less via material connected to it. it therefore requires more care in setting of the bonding parameters. for the same reason pina has no esd protection. in addition, please refer to the macom product bulle tin (document number 0201x-pbd-002-a). care must be taken when selecting chip capacitors, since they must have good low esr characteristics up to 1.0 ghz. it is also important that the termination materials of the capacitor be compatible with the attach method used. for example, tin/lead (pb/sn ) solder finish capacitors are incompatible with silver -filled epoxies. palladium/silver (pd/ag) terminations are compatible with silver filled epox ies. solder can be used only if the substrate thick-film inks are compatible with pb/sn solders. 4.6.2 recommended assembly procedures for esd protection the following steps are recommended for to-can assembly: ? ensure good humidity control in th e environment (to help minimize esd). ? consider using additional ionization of the air (also helps minimize esd). ? as a minimum, it is best to ensure that the body of the to-can header or the ground lead of the header is grounded through the wire-bonding fixture for the following steps. the wire bonder itself should also be grounded. 1. wire bond the ground pad(s) of the die first. 2. then wire bond the v cc pad to the to-can lead. 3. then wire bond any other pads going to the to-can leads (such as dout, dout and possibly mon) 4. next wire bond any capacitors inside the to-can. 5. inside the to-can, wire bond pink. 6. the final step is to wire bond pina.
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 19 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 4.7 tia use with externally biased detectors in some applications, macom tias are used with detectors biased at a voltag e greater than available from tia pin cathode supply. this works well if some basic cautions are observed. wh en turned off, the input to the tia exhibits the following i/v characteristic: figure 4-5. tia use with externally biased detectors, powered off pina unbiased -300 -250 -200 -150 -100 -50 0 50 100 -800 -600 -400 -200 0 200 400 600 800 1000 1200 mv a
M02011 m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support 20 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 in the positive direction after about 700 mv, the impedance of the input is relatively high. after the tia is turned on, the dc servo and agc circuits attempt to null any in put currents (up to the absolute maximum stated in ta b l e 1 -1 ) as shown by the i/v curve in figure 4-6 . it can be seen that any negative voltage below 200 mv is nulled and that any positive going voltage above the pina standing voltage is nulled by the dc servo. the dc servo upper bandwidth varies from part to part, but is generally at least 30 khz. when externally biasing a detector such as an apd wh ere the supply voltage of the apd exceeds that for pina ta b l e 1 -1 , care should be taken to power up the tia first and to keep the tia powered up until after the power supply voltage of the apd is removed. failure to do this with the tia unpowered may result in damage to the input fet gate at pina. in some cases the damage may be very subtle, in that nearly normal operation may be experienced with the damage causing slight reductions in bandwidth and corresponding reductions in input sensitivity. figure 4-6. tia use with externally biased detectors, powered on pina biased -1000 -800 -600 -400 -200 0 200 400 600 800 1000 -300 -200 -100 0 100 200 300 400 500 600 700 mv a
m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support M02011 21 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5 5.0 die specification figure 5-1. bare die layout mon pina pink v cc agc dout gnd gnd doutgnd 1 2 3 4 56 7 8 9b 10b 11 12 v cc dout doutgnd 9a 9c 10a 10a pad number pad x y 1 agc ?329 ?76 2 (1) v cc ?329 ?228 3 pink ?124 ?434 4 pina 124 ?434 5 (1) v cc 329 ?228 6mon 329 ?76 7dout 329 76 8 (1) dout gnd 329 228 9c (1, 2) gnd 329 360 9b (1, 2) gnd 255 434 9a (1, 2) gnd 124 434 10a (1, 2) gnd ?124 434 10b (1, 2) gnd ?255 434 10c (1, 2) gnd ?329 360 11 (1) doutgnd ?329 228 12 dout ?329 76 notes: 1. it is only necessary to bond one v cc pad and one gnd pad. however, bonding one of each pad (if available) on each side of the die is encouraged for improved performance in noisy environ- ments. 2. each location is an ac ceptable bonding location. notes: process technology: cmos, silicon nitride passivation die thickness: 300 m pad metallization: aluminium die size: 880 m x 1090 pad opening: 86 msq. octagonal pad: 70 m across flat pina (70 m x 70 m) pad centers in m referenced to center of device connect backside bias to ground
m/a-com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: http://www.macom.com/support m/a-com technology solutions inc. all rights reserved. information in this document is provided in connect ion with m/a-com technology solutions inc ("macom") products. these materials are provided by macom as a service to its customers and may be used for informational purposes only. except as provided in macom ' s terms and conditions of sale for such products or in any separate agreement related to this document, macom assumes no liability whatsoever. macom assumes no responsibility for errors or omissi ons in these materials. macom may make changes to specifications and product descriptions at any time, without notice. ma com makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities ar ising from future changes to its specifications and product descriptions. no license, ex press or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. these materials are provided "as is" withou t warranty of any kind, either express or implied, relating to sale and/or use of macom products i ncluding liability or warranties relating to fitness for a parti cular purpose, consequential or incidental damages, merchantability, or infringeme nt of any patent, copyright or other intellectual property right. macom further does not warrant the accuracy or completeness of the information, text, graph ics or other items contained within these materials. macom shall not be liable for any special, indirect, incidental, or consequential damages, including without li mitation, lost revenues or lost profits, which may result from the use of these materials. macom products are not intended for use in medical, lifes aving or life sustaining applications. macom customers using or selling macom products for use in such applications do so at their own risk and agree to fully indemnify macom for any damages resulting from such improper use or sale. M02011 22 cmos transimpedance amplifier with agc for fiber optic networks up to 622 mbps rev v5

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